SEMI® Global Update - October 2012
IN THIS ISSUE
Japan Semiconductor Industry -- Fabs, Equipment, and Materials

TSMC Unveils Schedule for 450mm Mass Production; Lithography is the Key

China to Invest $40 Billion by 2015 for Solar Development

Semiconductor Materials Market to Surpass $50 Billion in 2013

Semiconductor Industry Moves toward Automated LED Production on 6-inch Wafers

Taiwan President Speaks to 500+ Industry Leaders at SEMICON Taiwan Gala

Washington Update: Congress Leaves Unfinished Business

Successful SEMI Members Day in Korea

ARM, Corning, Micron and TSMC Share Strategies for Embracing Change


Event Calendar

ASIA

October 3-5
PV Taiwan 2012

October 12
Korea FPD Metrology Tech Committee Mtg

October 19
Korea Facilities Tech Committee Mtg

October 19
China LED Manufacturing Technology Conference

October 31-November 1
LED Tutorial 2012

December 5-7
SEMICON Japan

December 5-7
PV Japan


EUROPE

October 8-11
Standards Meetings

October 9-11
SEMICON Europa

October 9-11
Plastic Electronics Exhibition and Conference


NORTH AMERICA

October 11
Arizona Breakfast Forum

October 23-24
Strategic Materials Conference

October 28-November 1
Standards Fall 2012 Meetings

October 30
Austin Industry Outlook Forum

November 4-7
International Technology Partners Conference

November 8
SEMI Pacific Northwest Dinner Forum

Courses

  • Product Marketing
  • Supply Chain Mgmt
  • Acct Selling and Mgmt


  • Japan Semiconductor Industry -- Fabs, Equipment, and Materials
    By Dan Tracy, SEMI Industry Research and Statistics
    Semiconductor manufacturers in Japan are either consolidating or closing fabs, and, in several cases, transitioning to a "fab-lite" strategy, all in a restructuring effort to meet the market challenges ahead. While device manufacturers are consolidating manufacturing operations and plan to outsource more wafer fabrication and package assembly to foundries and packaging subcontractors, a large installed fab capacity remains in Japan.


    TSMC Unveils Schedule for 450 Mass Production; Lithography is the Key
    At the SEMICON Taiwan 2012 450mm Supply Chain Forum on September 7, leading foundries and equipment manufacturers (including TSMC, TEL, Lam Research, Applied Materials and KLA-Tencor) convened to discuss the latest trends in 450nm technology, opportunities and challenges.
    Related Presentation: "450mm Challenges and Opportunities" Dr. C.S. Yoo, TSMC (source: 450 Central website)


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    China to Invest $40 Billion by 2015 for Solar Development
    By Melody Song, SEMI Industry Research and Statistics
    On September 12, 2012, China's National Energy Administration (NEA) announced the finalized 12th Five-Year Plan for solar development. The plan sets a target of 21GW installed solar capacity by 2015, which includes 20GW PV installations and 1GW CSP installations.


    Semiconductor Materials Market to Surpass $50 Billion in 2013
    By Lara Chamness, SEMI Industry Research & Statistics
    Given current macroeconomic headwinds, this year is proving to be challenging to forecast. Most analysts have recently downgraded their semiconductor revenue forecasts to flat or low-single digits.


    Semiconductor Industry Moves toward Automated LED Production on 6-inch Wafers
    By Paula Doe, SEMI Emerging Markets
    With the fast-growing demand for HB-LEDs, the industry has added roughly 100 new fabs in the last five years, for a total of 169 LED fabs worldwide.


    SEMICON Japan 2012


    More News:

    Taiwan President Ma Ying-Jeou Speaks to 500+ Industry Leaders at SEMICON Taiwan Gala Dinner

    Washington Update: Congress Leaves Unfinished Business before November Elections

    Successful SEMI Members Day in Korea

    ARM, Corning, Micron and TSMC Share Strategies for Embracing Change -- at SEMICON Taiwan Executive Summit


    Call for Papers:
    ASMC 2013 - Due: Oct 31


    ITPC 2012


    Silicon Semiconductor


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