SEMI® Global Update ♦ November 2011
IN THIS ISSUE



Emerging Market Opportunities for SEMI Members

Mighty Japan Endures as Leader

450mm: Development Costs of $25-40 Billion; G450C Consortium Gears Up for Global Control

Double-Digit Growth in Power Semiconductor Modules Fueled by Energy Concerns

Lab-to-Fab Challenges and Synergies with CMOS Manufacturing Discussed at SEMICON Europa

3D-IC: Ushering in a New Era in the Semiconductor Industry

SOLARCON China: China's Premier PV Manufacturing Technology Platform

The Rise of China Domestic PV Equipment Suppliers

E-readers: Market Prospects and Technology Developments


SEMI CALENDAR

ASIA

November 9-11
SOLARCON India 2011

December 5-7
PVJapan 2011

December 7-9
SEMICON Japan 2011

February 7-9
SEMICON Korea 2012

February 7-9
LED Korea 2012

EUROPE

November 8-10
Successful Semiconductor Fabless

November 29
European Microelectronics Summit

December 8
Photonics TechBRIEFING

February 26-28
ISS Europe 2012

NORTH AMERICA

November 10
KGD Conference

November 14-15
Global Interposer Tech (GIT) 2011 Workshop

November 17
Power Semiconductor Tech Webcast

December 12-14
3-D Architectures for Semiconductor Integration and Packaging

January 15-18
Industry Strategy Symposium 2012

Classes

3D Pkg Revolution (new)

Fundamentals of Microchip Design and Fab (new)

Acct Support Boot Camp (new)

Silcotek




ASMC 2012
Call for Papers

Abstract Due Date Extended
to Nov. 11



FROM THE EVP OF SEMI EMERGING MARKETS

Emerging Market Opportunities for SEMI Members

Tom Morrow In the annual SEMI Member Satisfaction Survey, 90 percent of our members reported that helping promote and commercialize emerging market opportunities was "important" or "very important," and rated among the highest of all SEMI services provided to members. It also received nearly double the importance rating it received in 2007. SEMI members know that semiconductor processing technology-- and the products and services that enabled the amazing growth of the chip industry-- are growing in demand in areas like HB-LEDs, MEMS, printed/organic electronics, and power semiconductors.

In discussions with SEMI committees, individual member companies and manufacturers from around the world, I consistently hear the same message-- bring the established processes, Best Practices and world-class supply chain of the semiconductor industry to these new markets to help accelerate scale, quality and globalization. (more)

Tom Morrow
www.semi.org


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Mighty Japan Endures as Leader
By Christian Dieseldorff, SEMI
Japan's semiconductor industry has once again proven that it can overcome disaster and recover quickly. Japan is home to many semiconductor companies and has the largest share of total installed fab capacity. In addition, fabs in Japan lead in cutting-edge technology such as 24nm and 19nm NAND Flash.


450mm: Development Costs of $25-40 Billion; G450C Consortium Gears Up for Global Control
Representatives of SEMATECH, policy-makers from the European Commission, industry consortia, and technology suppliers met to discuss the 450mm transition at the recent SEMICON Europa. Highlights of the two-day session: the 450 transition price tag ($25-$40 billion) and the Global 450 Consortium (G450C).


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Double-Digit Growth in Power Semiconductor Modules Fueled by Energy Concerns
By Paula Doe, SEMI Adjacent Markets
Reducing energy usage means using more sophisticated power semiconductor devices, complete with new manufacturing issues. Expect double-digit growth for power semiconductor modules this year.
Register Now for the "Power Semi Tech" Webcast on Nov. 17.


Lab-to-Fab Challenges and Synergies with CMOS Manufacturing Discussed at SEMICON Europa
At the Plastic Electronics Conference at SEMICON Europa, executives from BASF, imec, Flextronics, STMicroelectronics, Fraunhofer, and ARM discussed the status and enormous potential of organic, large area and printed electronics-- and how to overcome the technical and market development challenges in displays, SSL, solar PV, logic/memory, and other applications.



December 7-9, 2011 in Makuhari Messe, Chiba, Japan
Guide to Sessions and Events
To learn more about exhibiting, click here.


3D-IC: Ushering in a New Era in the Semiconductor Industry
Semiconductor packaging technology has transformed from 2D into 3D stacking and the industry is working on many issues. Twenty-five industry executives shared their viewpoints at the "SiP Global Summit" held by SEMI in Taiwan. The three-day event attracted over 1,000 attendees from the industry.


SOLARCON China: China's Premier PV Manufacturing Technology Platform
SOLARCON China is on track to be China's premier photovoltaic (PV) manufacturing technology platform. Over 50 world-class PV technologists are already confirmed as speakers for SOLARCON China 2012 which takes place on March 20-22 in Shanghai.



The Rise of China Domestic PV Equipment Suppliers
By Melody Song, SEMI
For the first time since Q1'10, the worldwide PV equipment Book-to-Bill ratio dipped below parity to 0.88. However, Asia is the center of capacity expansion, led by China, and this trend will continue as 66% of the Q2'11 bookings were from China.


E-readers: Market Prospects and Technology Developments
By Harry Zervos, IDTechEx
E-readers, the rapidly improving alternative e-paper technology, still have big advantages in low-cost and low-power consumption that should continue to drive demand in consumer mobile applications. But continuing the fast growth of recent years will require identifying new markets as well.


Thank you for reading this newsletter. We hope that you find SEMI Global Update informative and relevant. Let us know if we can improve the content and quality of SEMI Global Update. Please send your ideas, comments and suggestions to:

Deborah Geiger
Content Manager, SEMI
3081 Zanker Road, San Jose, California, 95134
Tel: 1.408.943.6900; Fax: 1.408.428.9600; Email: marketingservices@semi.org
Website: www.semi.org

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