It's All about Packaging. In this Material World That We Are Dealing With, Who Is Your Partner?
By Dan Tracy, SEMI
Advanced packaging is clearly the enabling technology providing solutions for mobile applications and for semiconductor devices fabricated at 16 nm and below process nodes.
Continued Annual Growth for Silicon Shipment Volumes
Wafer Shipments Forecast to Increase in 2015, 2016, and 2017.
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China's New Rare Earth Policy and Industry Consolidation after the WTO Ruling
By Yu Bibby, Ph.D., TECHCET CA, LLC., October 20, 2015
On January 1, 2015, after losing its battle in the final ruling in the World Trade Organization (WTO), China ended its 16-year -old rare earth export quota system.
EU 10/100/20 Strategy - Shifting Gears and Keeping Europe in the Race
By Rania Georgoutsakou, SEMI
Significant developments in Europe's 10/100/20 strategy took place during SEMICON Europa 2015.
Power Electronics Manufacturing - from Concept to Production
By Paul Werbaneth, Intevac, Inc.
Great things are happening in New York State at the Northeast Forum on Power Electronics Manufacturing.
SEMI China Delegation Visits Japan
SEMI hosted a delegation that brought together several of the leading semiconductor equipment and materials companies from China with hosts from the leading companies in Japan.
GLOBAL SMT & PACKAGING
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Secondary Equipment Market Driven by IoT- 200mm Alive and Well
By Peter Connock, memsstar and Eduard Hoeberichts, FabMax
We may associate the Internet of Things (IoT) with a brave new world of connectivity, but much of this new world will be built on devices manufactured in mature 200mm fabs.