“Above and Beyond TSV for Advanced ICs” ─ SEMI European 3D Summit 2016

GRENOBLE, France ─ July 22, 2015 ─ SEMI today announced the fourth annual European 3D Summit. Entitled “European 3D Summit 2016: Above and Beyond TSV,” the advanced semiconductor Summit will take place on January 18-20, 2016 in Minatec in Grenoble, France.

The 2016 SEMI European 3D Summit will include a wide scope of 3D integrated circuit topics beyond Through-Silicon-Via (TSV) technology ─ with talks on FO-WLP/ e-WLB, Embedded Die, and 3D alternative technologies. Keynote and invited speakers will present their approaches and strategies for 3D Integration technologies, with specific attention on current adoption for applications such as memory, mobile, automobiles, wearables and more.  

The increasing implementation of 3D technology in microelectronics devices has reshaped the electronics market. SEMI will highlight the latest business challenges and opportunities with a market briefing where 3D and packaging industry experts will present business and market insights. Up to 30 companies working in the 3D sector will have the opportunity to exhibit their technologies at the 3D Summit exhibition.

SEMI will provide attendees networking opportunities throughout the event, including lunches, coffee breaks, a gala dinner and a complimentary one-on-one business meeting service. New this year: SEMI will offer attendees a chance to visit the Minatec Showroom, to learn about the latest innovations being developed in the Grenoble tech hub.

The  European 3D Summit steering committee includes executives from: ams AG, BESI, CEA-Leti, Evatech, EV Group, Fraunhofer-IZM, imec,  Scint-X,  SPTS, STMicroelectronics and SUSS Microtec.

The SEMI European 3D Summit consistently produces a large industry turnout receiving high satisfaction rates (97% overall satisfaction rate, 2012-2015).

Please visit www.semi.org/European3DSummit to register as an attendee or book a booth as an exhibitor. Sponsorship packages are also available. Early-bird pricing will be available until October 31. For all additional information, contact Anne-Marie Dutron, SEMI Europe Grenoble Office (adutron@semi.org).

About SEMI

SEMI is the global industry association serving the nano- and microelectronic manufacturing supply chains. Our 1,900 member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information on SEMI, visit www.semi.org.

Association Contacts

Stephan Raithel
Email: sraithel@semi.org
Phone: +49.30.303080770

Deborah Geiger
Email: dgeiger@semi.org
Phone: 408.943.7988


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