Opportunities for China's IC Supply Chain Development Showcased at Upcoming SEMICON China 2012

China Market IC Application Pavilion Focuses on Products and Services for IC Design and Fabless Manufacturing

SHANGHAI, China — February 14, 2012 — Fueled by private and government investment and the rising demand for electronic products, China continues to grow as a global center of semiconductor design and manufacturing. This rise has been accompanied by increasing demand for services and support across the supply chain, including design, IP, foundry, and assembly and test. The challenges and opportunities in China's growing IC marketplace is a key focus of the upcoming SEMICON China 2012 trade exhibition, March 20-22, at the Shanghai New International Exhibition Center (SNIEC).

The China Market IC Application Pavilion at SEMICON China will spotlight companies and technologies focused on serving the fabless and IC design community and will feature exhibits and content addressing critical issues shaping the IC market in China, including:

  • Focus on 450mm wafer manufacturing
  • Advanced automotive semiconductors
  • Power IC technology, including insulated gate bipolar transistors (IGBT)
  • Assembly and test
  • MEMS design and manufacturing
  • Advanced IC design techniques

Current Pavilion exhibitors include device makers and IC design houses, such as: ASE, ASMC, GENUSION, Giantec Semiconductor, Grace Semiconductor, Huahong-NEC, Huali, SMIC plus high-tech parks including the Pudong Government, Zhangjiang Group, and Incubator Base.

In addition to the IC Pavilion, a concurrent program “The China Market: IC from Design to Manufacturing” will take place Wednesday, March 22 from 08:30­-17:30 at the Kerry Hotel Pudong.  Industry scholars and technology experts will address topics on the local China IC industry and its future, including the progress of industry localization and supply chain development in China. Presentation topics include: Advanced IC design and manufacturing technologies; Trends and challenges for future IC development; IC manufacturing for telecommunications; Wireless systems: including 3G IC design, 4G IC design, and Network processors; LED drivers; and EDA tools.

Presenters include: Tony Chen, president of Asia Pacific and Japan, Grace Semiconductor; Peng Bai, vice president, Intel Corporation; Feng Gao, vice president, Shanghai Hua Hong NEC; Haijun Zhao, vice president, North Operations, SMIC; Dongkai Shangguan, vice president, Flextronics; and Sandeep Bharathi, vice president, Xilinx, Inc.

Pre-registration for SEMICON China is currently open. Visitors who register by February 29 receive “early-bird” discount pricing on paid conferences and qualify for special benefits and lucky draw opportunities. 

Exhibiting Opportunities at the China Market IC Application Pavilion are still available.  For more information on exhibiting, contact: Mr. Kevin Wu, 86.21.5027.0909 kwu@semi.org

About SEMI

SEMI is the global industry association serving the nano- and microelectronic manufacturing supply chains. SEMI member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Beijing, Bengaluru, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org.

Association Contacts

Vicky Zhou
SEMI China
Email: vzhou@semi.org
Phone: 86.21.5027.0909

Deborah Geiger
SEMI Headquarters
Email: dgeiger@semi.org
Phone: 408.943.7988

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