Global Semiconductor Packaging Materials Outlook 2011/2012- Multiuser

Global Semiconductor Packaging Materials Outlook 2011/2012 - Multi-User

A comprehensive study that examines the semiconductor packaging materials markets

Publication Date: November 2011  
Authors: SEMI and TechSearch International 
Format: .pdf, .xls, .ppt (includes three files)

Global Semiconductor Packaging Materials Outlook is a comprehensive market research study that examines semiconductor packaging technology trends and their impact on the packaging materials markets. Packaging materials markets are quantified, new opportunities are highlighted, and forecasts through 2015 are presented. 

Global Semiconductor Packaging Materials Outlook is an essential business tool for anyone interested in the plastic packaging materials arena. Packaging materials directly affect the performance, reliability and cost of semiconductors, and offer significant improvement potential.

Methodology

In-person interviews with material suppliers, packaging subcontractors and semiconductor manufacturers around the world are the sources of information for this study. Market size information is developed through primary research and modeling. Five-year market forecasts are developed based on different scenarios of new technology penetration and market growth.

Sample Report Download

Features

  • Technology trends
  • Regional market size
  • Five-year market forecast
  • Supplier market share
  • Market size in revenue and units
  • Capacity and utilization trends
  • Average selling prices and trends


Table of Contents

1 INTRODUCTION 
1.1 Methodology 
1.2 Assumptions 
1.3 Report Organization

2 SEMICONDUCTOR PACKAGING AND INDUSTRY TRENDS
2.1 Semiconductor Industry Trends - Industry Markets
2.2 Semiconductor Trends— Technology Overview
2.3 Packages and Electronic End-market Applications

3 SUBSTRATES 
3.1 Laminate Substrates
3.2 Build-up Substrates
3.3 Organic Substrate Technology Trends
3.4 Organic Substrate Material Markets and Forecasts
3.5 Organic Substrate Pricing
3.6 Organic Substrate Supply
3.7 Flex Circuit/Tape Substrates

4 LEADFRAMES
4.1 Leadframe Market and Technology Trends
4.2 Leadframe Markets
4.3 Leadframe Pricing
4.4 Leadframe Market Forecasts
4.5 Leadframe Supply

5 BONDING WIRE
5.1 Bonding Wire Market and Technology Trends
5.2 Bonding Wire Markets
5.3 Bonding Wire Pricing
5.4 Bonding Wire Market Forecasts
5.5 Bonding Wire Supply

6 MOLD COMPOUNDS
6.1 Mold Compound Technology Trends
6.2 Mold Compound Markets
6.3 Mold Compound Pricing
6.4 Mold Compound Market Forecasts
6.5 Mold Compound Supply

7 UNDERFILL MATERIALS
7.1 Underfill Technology Trends
7.2 Underfill Material Market and Forecast
7.3 Underfill Supply

8 LIQUID ENCAPSULANTS
8.1 Liquid Encapsulant Technology Trends
8.2 Liquid Encapsulant Markets
8.3 Liquid Encapsulant Market Forecasts
8.5 Liquid Encapsulant Supply

9 DIE ATTACH MATERIALS
9.1 Die Attach Technology Trends
9.2 Die Attach Markets
9.3 Die Attach Market Forecasts
9.4 Die Attach Supply

10 SOLDER BALLS
10.1 Solder Ball Material Technology Trends
10.2 Solder Ball Market and Forecast
10.3 Solder Ball Supply

11 WAFER LEVEL PACKAGE DIELECTRICS
11.1 Wafer Level Package Dielectrics Technology Trends
11.2 Wafer Level Package Dielectrics Market and Forecast
11.3 Wafer Level Package Dielectrics Supply

12 THERMAL INTERFACE MATERIALS
12.1 Thermal Interface Material Trends
12.2 Thermal Interface Material Types
12.3 Thermal Interface Material Market and Forecast
12.4 Thermal Interface Material Supply

13 SUMMARY AND CONCLUSIONS

14 APPENDICES
A. List of Acronyms and Abbreviations
B. Packaging Materials Supplier Web Site
C. List of Figures and Tables
D. About the Authors


Deliverables

This study has a user-friendly electronic format and includes:

  • Concise executive summary
  • Adobe Acrobat chapters for each materials segment
  • Excel workbook file summarizing market information
  • PowerPoint charts, ideal for presentations


About

About SEMI
SEMI is a global industry association serving companies that develop and provide manufacturing technology, materials and services used to make semiconductors, flat panel displays (FPDs) microelectromechanical systems (MEMS) and related microelectronics. SEMI maintains offices and hosts programs and activities in every major microelectronics and display manufacturing region around the world. SEMI maintains offices in Austin, Bangalore, Beijing, Brussels, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo and Washington, D.C. 

About TechSearch International, Inc. 
Founded in 1987, TechSearch International (Austin, Texas) is a technology licensing and consulting company specializing in accurate, relevant, and timely information on advanced packaging technology and market developments. 

 

Other Resources

Material Market Data Subscription (MMDS) 
World Fab Forecast 
FabFutures
 
World Fab Watch


 


 

Pricing

 

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Product #   Description

2160    Global Semiconductor Packaging Materials Outlook 2011/2012 Edition