ITPC 2012 Speakers

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Sunday, November 10

 
16:00-19:00     
Conference Check-in
18:00-19:30

Welcome Reception - Sponsored by Tokyo Electron, Ltd.

  

Monday, November 11

 
07:30-08:30Attendee Breakfast - Sponsored by KLA-Tencor

08:30-08:45

Welcome Remarks
Denny McGuirk, President & CEO, SEMI
Harvey Frye, Chairman, ITPC Global Committee;
Vice Chaiman, Tokyo Electron America

08:45-09:25Keynote:  Rob Chandhok, President of Qualcomm Internet Services and President of Qualcomm Innovation Center, Inc. and Senior Vice President of QCT
  
Session 1: Partners in Policy
  
09:25-10:00"The Road Ahead:  A Look at the Policies and Trends Shaping the Semiconductor Industry in 2013 and Beyond"
Brian Toohey, President, Semiconductor Industry Association (SIA)
10:00-10:15Break   
10:15-10:45Shaojun Wei, Director Research Center for Mobile Computing, Tsinghua University
10:45-12:00
Panel - Policy Mechanisms and Opportunities to Grow
 Moderator:  David Wilhoit, President & CEO, Siltronic Samsung Wafer
Panelists: 
Damian Chan, International Director for Americas, Singapore Economic Development Board
Chin-Tay Shih, Professor & Dean, College of Technology Management, National Tsinghua University Taiwan
Shaojun Wei*, Director Research Center for Mobile Computing, Tsinghua University Mobile Computing Technology China
12:00-13:30Lunch - Sponsored by Ebara
  
Session 2:  *Partners in Productivity
  
13:30-14:05"Productivity:  Darwin Meets Manufacturing"
Jackie Sturm, Vice President, Technology and Manufacturing Group, General Manager, Worldwide Materials, Intel Corporation
14:05-14:20
Break
14:20-14:55"The Age of Development Efficiency:  Delivering Effective Advanced Materials Fast"
Sung Han, Senior Vice President Global Technology, ATMI
14:55-15:30Frits Van Hout, Executive Vice President and Chief Marketing Officer, ASML
 
18:30-19:00
Reception - Sponsored by AZ Electronic Materials
19:00-22:00Banquet - Sponsored by AZ Electronic Materials
  

Tuesday, November 12

 
07:30-08:00
Attendee Breakfast
08:00-08:40Keynote:
"Toshiba's Semiconductor and Storage Products Strategy and the Renovation of the Semiconductor Industry in Japan"
Shozo Saito, Corporate Senior Executive Vice President, Toshiba
  
Session 3:  Partners in Profit
 
  
08:40-09:10
"The Power of the New Innovation Model"
Luc Van den hove, Chairman and CEO, imec
09:10-10:10Panel - 2.5D & 3D ICs Enable New User Experiences & Big Data
 Moderator - Ho-Ming Tong, General Manager, ASE Group
 Panelists:
Kurt Huang, Director of Corporate Marketing, UMC
Choon Lee, CTO, Amkor Group
 Akihiro Nitayama, Deputy General Manager, Center for Semiconductor Research & Development, Semiconductor & Storage Products Company, Toshiba Corporation
10:10-10:20Break
  
10:20-11:30Panel - Opportunities and Challenges in Wafer Fab Processes and Technologies
- Sponsored by Lam Research
 Moderator - Pat Lamey, President, PHL Advisors
 Panelists:
David Bennett, Vice President, Alliances, GLOBALFOUNDRIES
 David Hemker, CTO, Lam Research
 
Sung Ki Park, Executive  Vice President, R & D Center, SK hynix
 Shozo Saito, Corporate Senior Executive Vice President, Toshiba
  
11:30Morning Session ends
12:00Lunch
12:30Shotgun Start, Golf Tournament (Partners in Play)
18:30-19:30Reception
19:30-22:00Banquet
  

Wednesday, November 13

 
07:30-08:30
Attendee Breakfast
08:30-09:10Keynote:  Michael J.  Cadigan, VP/GM, Microelectronics, IBM
09:10-09:45"The Future of the Memory Market:  About to become more predictable?"
Rod Morgan, Vice President  Procurement, Micron Technology
09:45-09:55Break
 
Session 4:  Partners in Potential 
  
09:55-10:25"Partnering:  Its Evolution and Future Potential"
G Dan Hutcheson, Chairman & CEO, VLSI Research
10:25-12:00Panel - Changing Era Challenges (including 450 and litho) - Sponsored by Dainippon Screen
 Moderator:  Brian Trafas, CMO, KLA-Tencor
 Panelists:
Robert Bruck, Vice President, General Manager, Technology Manufacturing Engineering, Intel Corporation
 Kenji Washino, Executive Vice President, Tokyo Electron
 Michael Liehr, Executive Vice President of Innovation and Technology,  College of Nanoscale and Engineering (CNSE)
 Frits Van Hout, Executive Vice President and Chief Marketing Officer, ASML
  
12:00Closing Remarks
Harvey Frye, Chairman, ITPC Global Committee; Vice Chairman, Tokyo Electron America